Method and apparatus for reducing package height for microcircuit packages

摘要

An offset weld ring is brazed or soldered to the top surface of a flat pack frame to provide an offset weld surface for the welding of a lid to the package in which the heat applied during the welding process is moved away from the glass feedthroughs in the package, thereby permitting closer spacing of the lid to the glass feedthrough for minimizing overall package height and obtaining a low profile package.