| 摘要 |
PURPOSE:To obtain sufficient close contactness of wafer and substrate electrode without using metal material by forming a flat plate, a bar, a hollow jig and a spring with nonmetallic material or convering them with nonmetallic material so that the metal is not exposed. CONSTITUTION:A flat plate 5 for holding wafer 8 opposing to a target electrode 1, a bar 4 for supporting this flat plate 5, a hollow jig 3 to which such bar 4 is inserted through a spring 2, and a wafer positioning flat plate 12 which applies a force against the spring 2 in the direction of target electrode 1 through close contact with the rear surface of wafer 8 held by said flat plate 5 are provided. Said falt plates 5, 12, bar 4, hollow jig 3 and spring 2 are formed with nonmetallic material or are convered with nonmetallic material so that the metal part is not exposed. For example, the flat plate 5, bar 4, hollow jig 3 are made of quartz, the substrate electrode 9 is shifted toward the wafer 8 and is placed close contact with the rear surface of wafer 8 through a heat transmitting sheet 12. After it is placed close contact with the rear surface of wafer it is shifted until the distance between the wafer 8 and target electrode 1 becomes the predetermined value. |
