Method for sealing a ceramic molding

摘要

PCT No. PCT/DE78/00001 Sec. 371 Date Apr. 16, 1979 Sec. 102(e) Date Apr. 16, 1979 PCT Filed Jun. 1, 1978 PCT Pub. No. WO79/00101 PCT Pub. Date Mar. 8, 1979.The present invention provides a method for encapsulating a ceramic moulding, preferably a silicon ceramic moulding such that the encapsulated mouldings can be subjected to hot isostatic pressing without causing the pressure-transfer medium to penetrate into the pores of the moulding. Encapsulation is achieved by first evacuating the moulding, then filling it with nitrogen gas and thereafter immersing it in a silicon (Si) melt. In a preferred aspect the moulding is filled with nitrogen gas under positive pressure. Once the silicon melt has been deposited, pressure can be allowed to act on it externally.