| 摘要 |
A process is provided for forming a polymeric layer on a substrate wherein the substrate is held in a mold into which liquid monomer is injected for curing and is released during or before said curing so as to allow it to move to compensate for any shrinkage of the curing liquid monomer. For example, the process may comprise utilizing a mold having a removable lid, releasing the hold on the substrate before significant shrinkage of the curing liquid monomer, and venting the atmospheric pressure that portion of the mold remote from the surface of the substrate being coated and before significant shrinkage of the liquid monomer so that the substrate is allowed to move toward the removable lid. …<??>The process may achieve a polymeric layer on a substrate, wherein the polymeric layer has a substantially uniform thickness within close tolerances. |
