Apparatus and method for cutting a wiring pattern

摘要

An apparatus for cutting a faulty spot or area of a predetermined wiring pattern by radiating a laser beam and which includes a reset table in which a wafer chip is fixed in place on a support table. A radiating device is disposed above the rest table to permit the laser beam to be directed at the wiring pattern. A positioning device is connected to the radiating device to position the laser beam. Between the radiating device and the support table a cover is disposed to define a hermetically-sealed space including the wafer chip. A hole of the cover is coupled to a vacuum pump. After the space is placed in a vacuum the laser beam is radiated toward the wiring pattern to permit the portion of the wiring pattern to be cut.