发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To improve the heat resistance, resolution and sensitivity by adding a specified quinonediazido compound to an alkali-soluble resin. CONSTITUTION:This positive type photosensitive resin composition contains at least one kind of compound represented by the formula (where l is 0-3, m is 1-4, k is 1-4, k+l+m=5, n is 2-4, R1 is 1,2-naphthoquinonediazido-4-sulfonyl, 1,2-naphthoquinonediazido-5-sulfonyl or 1,2-benzoquinonediazido-4-sulfonyl, R2 is H, halogen, alkyl, aryl, aralkyl or the like, and Z is a residue of methane or an aromatic compound) by 5-100pts.wt. per 100pts.wt. alkali-soluble resin.
申请公布号 JPS60134235(A) 申请公布日期 1985.07.17
申请号 JP19830243583 申请日期 1983.12.23
申请人 NIPPON GOSEI GOMU KK 发明人 HOSAKA YUKIHIRO;MIURA TAKAO;HARITA YOSHIYUKI
分类号 C08K5/00;C08K5/22;C08K5/28;C08L23/00;C08L33/00;C08L33/02;C08L101/00;G03C1/72;G03F7/022;H01L21/027 主分类号 C08K5/00
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