Copper-nickel-tin-titanium alloy, process for the production thereof, and use thereof

摘要

In order to obtain, in particular, a homogeneous copper material which, at the same time, is to have sufficient mechanical strength, conductivity and resistance to softening, the copper alloy according to the invention comprises from 0.30 to 2.8% of nickel, from 0.25 to 3.0% of tin, from 0.12 to 1.5% of titanium, the remainder being copper and conventional impurities. The copper alloy is preferably produced by homogenisation at temperatures from 850 to 950 DEG C for from 1 to 24 hours, hot-rolling in one or more passes at temperatures from 600 to 800 DEG C and cooling to room temperature with a cooling rate from 10 DEG C per minute to 2000 DEG C per minute. The copper alloy is preferably used as a substrate material for semiconductors.