| 摘要 |
PURPOSE:To improve the characteristics of heat dissipation remarkably, and to mount parts with high density by dissipating heat generated from an LSI chip through a heat dissipating body fitted to a chip carrier. CONSTITUTION:A space in which a heat dissipating body 12 is loaded is formed to an upper section and a space in which an LSI chip 13 is loaded to a lower section respectively in a carrier proper 1, and a conductor circuit 16 through which artibrary positions on both surfaces are connected is fitted to a terminal board 15. Leads 17 for the LSI chip 13 are connected electrically to the conductor circuit 16 through thermocompression bonding. soldering, etc. while the LSI chip 13 is connected to the heat dissipating body 12 by a cementing material 14 consisting of solder or adhesives. The carrier proper is sealed with a sealing material 18, such as a resin, low melting-point glass, etc. for protection. Accordingly, since a chip carrier transmits heat over a conductor having thermal resistance lower than that of the quality of material of the carrier proper 11 such as alumina ceramics-for example, a copper-tungsten composite metal-and heat is transmitted over a heat sink, etc. mounted onto the chip carrier, the heat dissipation properties of heat are improved, and the LSI chip having a large calorific value can also be loaded. |
