| 摘要 |
A continuity testing fixture for simultaneously probing of microelectronic chip site pads having a cluster of probe pins extending from a top plate in the same precise orientation as the pads. The probe pins are individually urged into compliance by a resilient pad disposed beneath the pins forcing a sharp end into contiguous engagement allowing an external signal to determine continuity of the workpiece. Individual insulated wires are attached to each probe on one end and are encompassed within a cavity in the body terminating at a connector near the edge of the fixture for linking to the remote test source. In another embodiment, the probe pins are hollow and contain an insulated wire allowing an independent signal to be introduced by way of the connector through the pads indicating both compliance of the probe and continuity of the workpiece simultaneously and independently.
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