High density LSI package for logic circuits.

摘要

The invention relates to a high density LSI package for logic circuits for use in data processing and communications systems. The package comprises an alumina ceramic substrate (1), multiple wiring layers (2) over the upper surface of said substrate (1), and a plurality of leadless chip carriers (3) arranged over the upper surface of said multiple wiring layers (2). The multiple wiring layers (3) can connect the terminal (34) of any desired carrier (3) to any other terminal (34), and any desired terminal (34) to any desired input and output pin (11) erected in a grid form on the under surface of the substrate (1). The package provides high-speed and high-density performance and has excellent heat-diffusing properties.