发明名称 LOW-MELTING GLASS FOR SEALING OF SEMI-CONDUCTOR DEVICE
摘要 PURPOSE:Low-melting glass reducing occurrence of memory error, obtained by making a content of radioactive isotopes of unavoidable impurities <= a specific amount. CONSTITUTION:Lead borate glass consisting of about 70-85wt% PbO and about 10-13wt% B2O3 as main component, which are blended with a small amount of Al2O3, SiO2, ZnO, PbF2, etc., is used low-melting glass for sealing semicoductor devices airtightly. A content of radioactive isotopes of unavoidable impurities contains in the glass is limited to <20ppb, and number of counts of radioactive alpha particle is <=0.1CPH/cm<2>. By using this glass, semiconductor devices having high reliability free from occurrence of memory error are obtained.
申请公布号 JPS59169955(A) 申请公布日期 1984.09.26
申请号 JP19830041709 申请日期 1983.03.14
申请人 MITSUBISHI KINZOKU KK 发明人 HOSODA NAOYUKI;UCHIYAMA NAOKI
分类号 C03C3/072;C03C3/14;C03C4/16;C03C8/24;C03C14/00;H01L23/02;H01L23/10 主分类号 C03C3/072
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