| 摘要 |
<p>PURPOSE:To simplify a process and to obtain a thermal head in good yield, by a method wherein a conductive film is formed on a resistance film and the width of the resistor pattern of a diode connection part is formed in a width narrower than that of the resistor pattern of a heat generating part while the latter is damaged and cut by burning. CONSTITUTION:A resistnce film 2 is uniformly formed on an insulating substrate 1 and a conductive film 2 while a conductor pattern 23 is formed by photo- lighographic etching and a part of said pattern 23 is etched only over a predetermined length to form a heat generating part 24 and a diode connection part 25. After a resistor pattern 22 is formed by photo-lithographic etching and the pattern width W1 of the resistor pattern 22b of the diode connection part 25 is set to a width narrower than the pattern width W of the resistor pattern 22a of the heat generating part 24, a protective film 26 is applied to the heat generating part 24 while conductor electroplating 27 is applied onto the conductor pattern 23 to perform wiring. At last, a current for damaging and cutting only the resistor pattern 22b by burning is flowed to provide a cut part 28.</p> |
