首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SISTEMA PARA SOLDAGEM
摘要
申请公布号
BR8304110(A)
申请公布日期
1984.04.24
申请号
BR19830004110
申请日期
1983.08.01
申请人
P.P.I. PERFOMANCE PROCESS INTERNATIONAL, N.V.
发明人
JOHN GARNET CHRUCH
分类号
B23K9/16;B23K9/173;B23K35/38;(IPC1-7):B23K9/00
主分类号
B23K9/16
代理机构
代理人
主权项
地址
您可能感兴趣的专利
PASSIVATED UPSTANDING NANOSTRUCTURES AND METHODS OF MAKING THE SAME
THREE-DIMENSIONAL THIN-FILM SEMICONDUCTOR SUBSTRATE WITH THROUGH-HOLES AND METHODS OF MANUFACTURING
PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE
CDHGTE PHOTODIODES ARRAY
INFRARED SENSOR AND METHOD FOR MANUFACTURING SAME, FILTER MEMBER FOR INFRARED SENSOR, AND PHOTOCOUPLER
SEMICONDUCTOR DEVICE AND DISPLAY DEVICE HAVING THE SAME
SEMICONDUCTOR DEVICE AND FORMATION THEREOF
SELF-ALIGNED CONTACT OPENINGS OVER FINS OF A SEMICONDUCTOR DEVICE
VERTICAL SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE VERTICAL SEMICONDUCTOR DEVICE
TENSILE NITRIDE PROFILE SHAPER ETCH TO PROVIDE VOID FREE GAPFILL
Vertical Semiconductor Device
Organic P-N Junction Based Ultraviolet Detection Device And Ultraviolet Image Detector Using Same
PHOTOELECTRIC CONVERSION ELEMENT AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR DEVICE
SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE
Array Substrate, Method of Manufacturing The Same and Display Device
THERMAL INTERFACE COMPOSITIONS AND METHODS FOR MAKING AND USING SAME
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE