| 摘要 |
PCT No. PCT/US81/00059 Sec. 371 Date Jan. 15, 1981 Sec. 102(e) Date Jan. 15, 1981 PCT Filed Jan. 15, 1981 PCT Pub. No. WO82/02458 PCT Pub. Date Jul. 22, 1982.An improved integrated circuit package (10) includes a cover (12), an intermediate subassembly (14) and a bottom subassembly (16). The intermediate and bottom subassemblies (14, 16) include lead frames (48, 22) respectively embedded therein, as well as openings which define a cavity for a semiconductor chip. The external lead pins (24) of the bottom subassembly (16) permit interconnection of the package with a circuit board or the like, while the external contacts (50) of the intermediate subassembly (14) cooperate with openings (62) in the cover to provide integral socket connections for other semiconductor packages or electrical components.
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