发明名称 FORMATION OF METAL CONDUCTOR LAYER
摘要 PURPOSE:To form a conductor layer with high purity and excellent crystalline condition by a deposition chamber composed economically by a method wherein a metal element is sputtered toward a substrate and deposited on the substrate in ionized or acivated hydrogen so that the material, composition and an exhaust system of the deposition chamber can be simplified. CONSTITUTION:While the temperature of a substrate 2 is kept at room temperature and a bell jar 1 is exhausted at the rate of 1,000l/min, hydrogen, activated by a hydrogen discharge tube 9 to which DC voltage of 600V is applied is introduced toward the substrate 2 to which DC voltage of -600V is applied at the current rate of 80ml/min. and Cr is heated and evaporated to form a Cr film of approximately 1,200Angstrom thickness. As the activated hydrogen is attracted by the substrate 2 with a negative potential effectively, the prevention effect against impurity contamination into the deposited film is completely enough. In the hydrogen discharge tube 9, hydrogen supplied through a gas inlet 21 generates a glow discharge in a discharge space by applying a voltage between one electrode member 22 and another electrode member 26 so that hydrogen is activated by electronic energy.
申请公布号 JPS5957423(A) 申请公布日期 1984.04.03
申请号 JP19820168102 申请日期 1982.09.27
申请人 KONISHIROKU SHASHIN KOGYO KK 发明人 SHINDOU MASANARI;SATOU SHIGERU
分类号 C23C14/14;H01L21/285 主分类号 C23C14/14
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