| 摘要 |
PURPOSE:To miniaturize the structure of devices, facilitate the assembly, and make the cost low by a method wherein a semiconductor element substrate is electrically connected t an electric wiring circuit of a clear insulation plate via projection form metallic conductors provided on the circuit of the semiconductor element substrate. CONSTITUTION:The semiconductor element substrate 5 is mounted, on the conductive printed circuit 4 printed on the clear insulation plate 2 such as a glass, by bumps 6 composed of solder or Au, etc. provided on the circuit, so as to accurately oppose in optical manner to the input light 1 passing through photo receiving lenses 9 of an optical system unit 10. This is because the relative position becomes constant by the self-alignment effect of fusion connection due to the solder bumps 6. The element substrate 5 is sealed by a case 7 composed of an insulator, and then clip terminals 3 are joined by solder as the output terminals to an external electronic circuit. Accordingly, positioning is facilitated; the case 7 is sufficient enough to be just an accumulator, not needed to be a ceramic, and the use of resin, etc. is also enabled. |
