摘要 |
<p>An improved lead frame (10) and method as shown in Figs. 1 and 2 in which an adhesive tape strip (14) such as mylar is rolled or pressed along the lower face (26) of the lead frame (12) to contact the lead frame (12) lower face (26) and bonding pad (18) lower surface (30). Upon removal of the tags (20) retaining the individual circuit elements (18 and 32) to the lead frame (12), the parts are maintained in their existing orientation and position by the adhesive tape strip (14) in conjunction with the lead frame (12). The circuit elements (18 and 32) may then be handled as a unit by means of the lead frame (12)/adhesive tape strip (14) combination in subsequent testing, marking, lead bending or other handling operations. </p> |