| 摘要 |
PURPOSE:To reliably couple lead wirings by utilizing the nail head of bonding wirings to a terminal electrode. CONSTITUTION:Epoxy resin 10 is coated on the bottom 2 of a container 1, terminal electrodes 7a, 7b are formed, a sapphire substrate 4, to which an element is fixed, is placed, and the resin is solidified in a furnace of 50 deg.C. Then, the insulating coatings of twisted lead wirings 8a, 8b at the ends are removed, Ni-plating, Au-plating are superposed to form conductive parts 9a, 9b, epoxy resin 11 is coated in advance along the side surface of the container 1, the wirings 8a, 8b are contacted, and the resin is solidified again at approx. 50 deg.C. Then, Au lead wirings 6a, 6b led from an element are thermally press-bonded to the electrodes 7a, 7b. Further, the parts 9a, 9b of the wirings 8a, 8b are respectively thermally press-bonded to the electrodes 7a, 7b, the other ends are cut, and bonded to the electrodes 7a, 7b via nail heads 12a, 12b to complete it. According to this configuration, the characteristics of an infrared ray detector can be measured in high reliability. |
