发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve efficiency of packing for shipping and realize automatic measurement by forming the guide for alignment at the area near the three corners of a square protection frame which protects a plurality of leads extended outward from the side surfaces of sealed package. CONSTITUTION:A plurality of leads 23 and extended in four directions from the side surface of a resin sealed layer 21 and a protection frame 24 is provided, being isolated from the end of lead 23, at the outside of the lead 23. A protection frame 24 is connected to an upper mount substrate 22 through the bridges 251-254 at the areas corresponding to four corners of the resin sealed layer 21. Since the cut-away portions 271, 272, 28 which are used as the guides for alignment to the automatic measuring apparatus during the measurement of characteristics, are provided at the positions near three corners of the protection frame 24 in such a manner as destroying symmetry of the whole, the direction can be confirmed very easily.
申请公布号 JPS598363(A) 申请公布日期 1984.01.17
申请号 JP19820117223 申请日期 1982.07.06
申请人 TOKYO SHIBAURA DENKI KK 发明人 NOGUCHI HIDEO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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