发明名称 |
FORMATION OF THIN SEMICONDUCTOR FILM |
摘要 |
PURPOSE:To form a thin semiconductor film of a large area from a seed in one direction when a so-called SOI film is formed, by radiating energy beams on the seed in part of an insulating film in one direction to deposit a semiconductor film and by carrying out epitaxial growth on the film. CONSTITUTION:A sample having an opening (seed) 3 in part of an insulating film (oxide film) 2 formed on a single crystal semiconductor substrate (silicon substrate) 1 is put in a gas contg. semiconductor atoms for forming a film. Energy beams (ion beams) 5 are radiated on the opening 3 in the insulating film 2 in one direction under heating to deposit a semiconductor film 4 on the film 2 from the opening 3. A semiconductor film is further formed on the film 4 by epitaxial growth.
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申请公布号 |
JPS63107894(A) |
申请公布日期 |
1988.05.12 |
申请号 |
JP19860253040 |
申请日期 |
1986.10.23 |
申请人 |
NEC CORP |
发明人 |
SAITO SHUICHI;OKABAYASHI HIDEKAZU;NAMITA HIROMITSU |
分类号 |
C30B25/02;C30B23/08;H01L21/205 |
主分类号 |
C30B25/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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