| 摘要 |
<p>PURPOSE:To facilitate soldering, by using a printed wiring board which has through-holes at the fitting position of chip parts of conductors formed on the top side, and fitting the chip parts to the top and reverse sides of the printed wiring board with an adhesive and dipping the reverse side in molten solder. CONSTITUTION:The printed wiring board in used has conductor layers on the top and reverse sides and the through-holes at the fitting positions of chip part of the top-surface conductor layer, and the chip parts are adhered to the top and reverse surfaces with an adhesive. Then, the reverse surface of the printed wiring board is dipped in the molten solder to solder the reverse-surface chip parts to the conductor layer of the printed wiring board, and the solder is led to the surface side through the through-hole to solder the top-surface chip parts to the conductor layer.</p> |
