发明名称 |
Thermally balanced leadless microelectronic circuit chip carrier |
摘要 |
A thermally balanced leadless microelectronic circuit chip carrier in which the chip is mounted directly on a heat sinking member by means of a conductive stress relieving polyimide. The heat sinking member, which has a support surface for the chip and an extending threaded shaft, is held by a carrier member thermally compatible with the surface on which the package is to be used. The shaft passes through the carrier member and receiving surface to a heat sinking nut which holds the package to the receiving surface. Leads on the carrier member surface are used to connect the receiving surface to the wires bonded to the chip contacts.
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申请公布号 |
US4420767(A) |
申请公布日期 |
1983.12.13 |
申请号 |
US19800181159 |
申请日期 |
1980.08.22 |
申请人 |
ZILOG, INC. |
发明人 |
HODGE, ROBIN H.;BRODSKY, MARK A. |
分类号 |
H01L23/047;H01L23/36;H01L23/482;H01L23/498;H05K1/02;H05K3/32;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/047 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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