发明名称 RESIN COMPOSITION FOR EXTRUSION MOLDING
摘要 <p>PURPOSE:The titled composition having low change with extrusion during molding, and balanced low-temperature heat sealability rigidity, etc., obtained by blending individually specific crystalline propylene polymer, low-density ethylene polymer and low-density polyethylene. CONSTITUTION:(A) A crystalline propylene polymer (e.g., propylene-ethylene copolymer, etc.) having 0.1-20g/10min melt flow rate is blended with (B) a low- density ethylene polymer having 0.910-0.935g/cm<3> density and 2-10wt% monomer content prepared by using a Ziegler catalyst, and (C) a low-density polyethylene having 0.910-0.935g/cm<3> density, 0.5-20g/10min melt flow rate, and 1.2-2.3 memory effect, prepared by high-pressure method. 100pts.wt. total amounts of 30-80pts.wt. component A and 70-20pts.wt. component B are blended with 2-20pts.wt. component C.</p>
申请公布号 JPS58206647(A) 申请公布日期 1983.12.01
申请号 JP19820089820 申请日期 1982.05.28
申请人 MITSUBISHI YUKA KK 发明人 YAMAMOTO KOUJI;OONISHI AKINORI
分类号 C08L23/00;C08L7/00;C08L21/00;C08L23/08;C08L23/10;C08L23/12;C08L23/16;C08L51/00;C08L51/02;C08L77/00;C08L101/00 主分类号 C08L23/00
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