发明名称 AUTOMATIC SUPPLY METHOD OF SOLDER
摘要 PURPOSE:To eliminate the variation in supply and to supply linear solder in conformity with various conditions in a laser soldering metod, by detecting the supply position of the linear solder with high accuracy. CONSTITUTION:Linear solder 1 is supplied at a correct rate at a velocity V1 from the start position up to L1, and is returned at the stepwise velocities V2, V3 quickly at a specified length (from the position of a sensor 4 up to the position behind the same). The V2 is the velocity in a range 7 where a laser beam is irradiated, and the V3 is the velocity beyond said range. The solder 1 is then supplied at a velocity V4 up to the sensor position, where the solder is positioned with high accuracy by the sensor 4. The solder is supplied at a velocity V5 from said position up to L5. Thereafter, the solder is kept standing by in said position and the next cycle is started.
申请公布号 JPS58202970(A) 申请公布日期 1983.11.26
申请号 JP19820084834 申请日期 1982.05.21
申请人 HITACHI SEISAKUSHO KK 发明人 CHIKAOKA RIYOUSAKU;SUZUKI MUNENOBU;KASHIMURA NOBORU;MOROI FUKAMI
分类号 B23K3/06;(IPC1-7):23K3/06 主分类号 B23K3/06
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