| 摘要 |
The semiconductor contact surfaces (2) of the heat sink (1) for liquid-cooling power semiconductor devices has cooling slots (3) which are connected to a connecting channel (7) for supplying the cooling liquid. The effect of this solution is that the cooling liquid is able to cool the surface of the semiconductor device to be cooled partly by direct contact, the heat sink (1), which touches the surface to be cooled in the unslotted subsurfaces between the cooling slots (3) and absorbs some of the heat loss, being cooled at the same time. Direct contact of the cooling liquid eliminates the heat conduction transfer resistance in the cooling slots (3), thereby substantially improving the cooling action of the cooling liquid. <IMAGE>
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