| 摘要 |
A lead frame apparatus for providing electrical connections to an integrated circuit includes a paddle 10 to which the integrated circuit is attached, a series of electrically conductive leads 12 extending outward from opposite sides of the paddle 10, and flared regions 15 of generally expanding width extending outward from opposite sides of the paddle 10. In the preferred embodiment the flared region 18 and the electrically conductive leads 12 are maintained in alignment by tie and dam bars 15 and 17 which are removed after the lead frame 5 is encapsulated. |
