| 摘要 |
PURPOSE:To facilitate resin sealing molding by a transfer molding method by forming a circuit element placing part, an external lead wirings of conductive foils, and isolation bands insulated and isolated at both sides as a lead frame on a flxible insulating plate. CONSTITUTION:A circuit element placing part 2, external lead wirings 3, of nickel-plated copper foils, and isolation bands 4 insulated and isolated at both sides are formed as a dual line type lead frame on one side surface of a flexible insulating plate 1. In this structure, the part 2 is formed in a size sufficient to place an IC chip, one or more parts 2 are formed, conductively connected to the prescribed one of the wirings 3, isolated wirings 5 which are not connected to the wirings 3 are formed in the frame, and utilized as mutual connection internal conductor between the circuit elements. Through holes 6 are opened at the wirings 5 and 3 to be convenient when a copper foil is provided on the back surface, and holes 7 are further opened at the arbitrary positions, thereby improving the moldability when sealing with resin. |
