| 摘要 |
PURPOSE:To automaticalky set an IC package to a workhead by storing the package in a magazine. CONSTITUTION:A magazine 10 is set to a holding member 7, compressed air is fed, thereby lifting a piston 5, and the membmer 7 is lifted upwardly. An IC package 11 is lifted at its index along the guide groove 16 of a pressing plate 12, and a base is projected from the hole 14 of the pressing plate with a correct directivity. An IC Chip is wire bonded onto the base in this state. In this case, a shaft 2 is rotated whenever one wire is bonded, the bonding step is sequentially performed, and one IC package is wire bonded when it is rotated by on revolution. At this time the pneumatic pressure to a cylinder 4 is reduced, thereby lowering the member 7, the magazine 10 is fed at one pitch, and the next IC package is moved underneath the pressing plate 12. The compressed air is again fed from this, and the same operation as above is repeated. |
