发明名称 JOINING METHOD FOR TI-AL
摘要 PURPOSE:To reduce plastic deformation of Al and perform good joining destructing Al oxide film in joining a Ti member and an Al member by performing joining inserting an Al plate having Si phase between the two. CONSTITUTION:An Al-Si plate 2 is inserted between a Ti plate 1 and an Al plate 3. These are piled up and heated in vacuum or in atmosphere of inert gas or reducing gas and pressure is applied on them. Al-Si plates 2 disappear, Ti plates 1 adhere closely to Al plates 3, and joining high in airtightness and excellent in tensile strength of the joined part can be effected.
申请公布号 JPS5870986(A) 申请公布日期 1983.04.27
申请号 JP19810168692 申请日期 1981.10.23
申请人 HITACHI SEISAKUSHO KK 发明人 YAMAMOTO AKIHIKO;NAKAE HIDEO;KOUNO AKIOMI
分类号 B23K20/00;B23K20/233;B23K35/00 主分类号 B23K20/00
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