| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose reliability is high in which any camber, the damage or deformation of an IC chip or the like, or any shift in position or the like is absent, and an industrially advantageous semiconductor device manufacturing method in which a manufacturing process is simplified. SOLUTION: This is a semiconductor device in which a substrate on which a semiconductor electronic parts is loaded is integrally adhered to the laminated layer boundary part of a resin molded product in which two resin layers are integrally fused without any substantial void part. In a method for manufacturing this semiconductor device, the fused resin is extruded from the slit of the tip of an extruder 7, and the substrate on which the semiconductor electronic part is loaded is projected to the void between the resin layers so that a structural body covered with the fused resin layers can be obtained, and then the structural body is pressured and formed so as to be integrally fused in a pair of freely openable and closable molding die cavities. |
