Electronic package.

摘要

A cooling system for an electronic package has a support substrate (12) with at least one electronic device (20) and a cover (14) in spaced proximity to the device. A thermal bridge for conducting heat from the device to the cover includes a relatively thick (24) metal sheet provided with cuts that define at least one tab element (34, 35) with grooves (30, 32) that make it bendable. Spring means (26) selectively urge the tab element into contact with the device.