| 摘要 |
PURPOSE:To improve the output characteristic and the moisture resistant characteristics of a semiconductor device by employing a heat sink plate formed by bending a metal strip plate. CONSTITUTION:A metal strip plate is bent to form a heat sink plate 3. A semiconductor pellet 1 is secured to the one outer surface 6 of the plate 3, and the other outer surface 7 is exposed from resin 5. With this structure, the plate can be substantially increased in size and in surface area, thereby improving the heat sink property. Accordingly, the output characteristic can be largely improved. Since the outer surface 7 is disposed at the position far from the pellet 1, the route from the sealing surface of the pellet 1 can be increased to remarkably improve the moisture resistant characteristic of a transistor. |
