发明名称 HEAT TREATMENT EQUIPMENT FOR SEMICONDUCTOR
摘要 PURPOSE:To prevent the falling of a wafer due to the softening of a boat at the time of a high temperature by mounting a vertically movable base into a longitudinal cylindrical furnace body, hanging the boat on a strut on the base and maintaining the wafer into a holding groove in the boat in a stepped manner. CONSTITUTION:A connector 8 is engaged with a hook-shaped supporter 15 on the holder P side, using a semicylindrical cover 9 for the boat B as an outside surface, and the boat B is hung down from a holder P. Unified both B and P are turned by a shaft 12 at the lower end of the holder P by a motor M on thc outside of a furnace, and driven vertically by a shaft S and an arm A. The boat B in which wafers W are maintained is heated to 1000 deg.C or more in a furnace body 1. Since the boat B is suspended and supported to the holder P, it is not curved, and the slip-off and falling of the wafers W can be prevented.
申请公布号 JPS63178519(A) 申请公布日期 1988.07.22
申请号 JP19870009008 申请日期 1987.01.20
申请人 TOSHIBA CORP 发明人 KAMEDA YOSHIO
分类号 H01L21/31;H01L21/205;H01L21/22;H01L21/673;H01L21/68 主分类号 H01L21/31
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