| 摘要 |
PURPOSE:To prevent warping of work at the time of applying adhesive by providing cavities or penetration holes, to release excessive adhesive, to the base plate which holds work of thin plate by virtue of adhesive. CONSTITUTION:Seats 23 to stick wafers 2 on at equal intervals are located on the flat surface 22 of a disc type base plate 21. A number of penetration holes 24 are provided to the seat 23. Before wafers 2 are placed, the base plate 21 is put on a heating plate 32, heated, and paraffin is applied to the seats. On each seat a silicon wafer 2 is placed and then a pressing plate 36 is pressed down from above via a cushion 35. The subsequent cooling process establishes the adhesion of silicon wafers 2 to the seats 23. The base plate 21 is then mounted on a lapping machine where the wafers 2 are polished. |
