发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve wet resistance of aluminum pad electrode by employing a structure to cover the end part of pad electrode through the alumina converting film with the opening of through hole of aluminum pad electrode prior to formation of lower layer insulation protection film. CONSTITUTION:The end part of an aluminum pad electrode 3 allows selective formation of an aluminum converting film 4 prior to formation of an insulation protection film 5. The alumina converting film 4 is formed in such a wide range as to include the end part of the aluminum pad electrode 3 including the side wall and only leaving the bonding region. Therefore, the opening of the through hole formed on the aluminum pad electrode 3 is indirectly covered with the alumina converting film 4. In this case, the alumina converting film 4 works as a passivation film to the covering surface of the aluminum pad electrode 3 and thereby prevents water content from entering the aluminum pad electrode 3 to corrode the inside thereof. Namely, wet resistance at the opening of the through hole of aluminum pad electrode 3 can be improved.
申请公布号 JPS63208225(A) 申请公布日期 1988.08.29
申请号 JP19870041878 申请日期 1987.02.24
申请人 NEC CORP 发明人 TAKAO SEIJI
分类号 H01L21/314;H01L21/3205;H01L21/60;H01L23/52 主分类号 H01L21/314
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