SEMICONDUCTOR MODULUS

摘要

The invention relates to a semiconductor module having at least two semiconductor elements (1, 1') accommodated in a common package. The semiconductor module in accordance with the invention comprises an outer part (2) and an inner part (3). The semiconductor components (1, 1') are situated on a mounting surface (4) of the outer part (2) of the module package between the contact leads (5, 6, 7). The contact leads (5, 6, 7) are pressed against the semiconductor components (1, 1') via a centring insert (8, 8') by a spring system (9, 9'). A supporting insert (10, 10') is mounted on the spring system (9, 9'), which is situated in a recess (11, 11') in the inner part (3) of the module package and the contact leads (5, 6, 7) are routed through the recess (11, 11'). The outer part (2) and the inner part (3) of the module package are joined together mechanically in an inseparable manner. Its general-purpose design approach in accordance with the invention earmarks the semiconductor module for a wide range of applications, in particular in the field of power electronics and in other fields of use in which it is necessary to achieve a compact structure and high reliability of the latter.