| 摘要 |
PURPOSE:To reduce by half the connecting portions of a hybrid integrated circuit by forming leads for external terminal of a frame and connecting the leads for the external terminal directly to the electrodes of an IC substrate without using wires nor lead wires. CONSTITUTION:A frame 1 has leads 8 for external terminal, the leads 8 are pressed to be reduced in thickness, are then bent to be brought into the position of the respective electrodes 5 of an IC as a connecting part. The leads 8 are disposed at a frame 1 corresponding to the electrodes 5 of the IC. When the frame 1 is bonded at 3 to a substrate 2, the connecting part 10 of the leads 8 is positioned at the respective electrodes 5, and is thereafter soldered at 6 to complete it. With this configuration, the molten part is reduced by half from the conventional one, and an IC of inexpensive cost and high reliability can be obtained. |
