发明名称 |
Substrate and integrated circuit module with this substrate. |
摘要 |
<p>A multi-layer substrate (30) comprises a matrix of sintered silicon particles (27) joined by a thin insulating layer (29) of a silicon compound, e.g. silicon dioxide or silicon nitride. Semiconductor circuit chips (14) are bonded to the surface of the substrate (30) to form an electrically connected, unitary integrated circuit module structure.</p> |
申请公布号 |
EP0038931(A2) |
申请公布日期 |
1981.11.04 |
申请号 |
EP19810102043 |
申请日期 |
1981.03.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDMONDS, HAROLD DONALD;MARKOVITS, GARY |
分类号 |
H05K3/46;H01B3/12;H01L23/15;H01L23/538;H05K1/03;(IPC1-7):01L23/14;01L23/54 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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