发明名称 PREPARATION OF HIGHLY ELECTROCONDUCTIVE ACETYLENE HIGH POLYMER MOLDED PRODUCT
摘要 PURPOSE:To obtain the titled molded product useful as a material for an electric device etc., by the pressure molding and the calendering of a gel-like material consisting of an acetylene high polymer and an inert org. solvent, followed by treatment with an electron acceptor or donor compd. CONSTITUTION:A gel-like material consisting of 5-95wt% acetylene high polymer of 50% or more cis content and 95-5wt% inert org. solvent (e.g., toluene) is molded under pressure at a temp <=50 deg.C and at a pressure of 10-1,000Kg/cm<2>. It is possible to freely control electrical conductivity over a wide rang from 10<-8>-3X10<-3> OMEGA<-1>.cm<-1>, by treating an acetylene high polymer sheet or film obtd. by the calendering of the resulting molded product at a temp. <=50 deg.C, with an electron accepting compd. (e.g., iodine or sulfuric acid) or an electron donor compd. (e.g., Na or K). The highly conductive acetylene high polymer is a P type or n type semiconductor, and it is possible to use it as an electrical or electronic device. It is also possible to produce a P-n heterojunction device by use of it depending on combination.
申请公布号 JPS56131636(A) 申请公布日期 1981.10.15
申请号 JP19800034686 申请日期 1980.03.21
申请人 SHOWA DENKO KK 发明人 KOBAYASHI MASAO;KIRA MASAAKI;YAMAGUCHI KANEYA
分类号 B29C43/00;B29C33/00;B29C43/24;B29C43/32;B29C43/52;B29C43/58;B29K105/34;C08J7/12;H01L51/05;H01L51/40 主分类号 B29C43/00
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