发明名称 ETCHING METHOD
摘要 PURPOSE:To perform etching to the desired depth with excellnt reproducibility by etching an Si wafer together with a monitor pellet having a part whose width can be etched out in a specified time. CONSTITUTION:The (100) face of the monitor pellet is anisotropically etched slowly by the liquid whose main component is KOH, and the monitor pellet 32 having the desired depth (thickness) is obtained by measuring the thickness. The pellet and a wafer to be etched 33 are attached to a holder 31 and immersed into the etching liquid 34. When the monitor pellet 32 disappears, the wafer 33 is taken out and washed with water. Since a sensing part 43 of said monitor is formed so as to possess a desired etching depth, the wafer 33 can be etched with excellent reproducibility. If the area other than the part 32 is covered by a material 41 which is not etched, and a material whose color is readily identified is attached to the back of the monitor, the time of the completion of the etching can be easily identified.
申请公布号 JPS56114330(A) 申请公布日期 1981.09.08
申请号 JP19800016665 申请日期 1980.02.15
申请人 HITACHI LTD 发明人 TAKAHASHI MASAAKI;MISAWA YUTAKA;YATSUNO KOUMEI
分类号 H01L21/306 主分类号 H01L21/306
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