| 摘要 |
PURPOSE:To prevent a void and a crack from being caused by a method wherein a hardened pellet layer is formed in advance on the rear of a semiconductor element pellet or on a face to mount a semiconductor substrate, a paste material is coated on the semiconductor device substrate, the element pellet is mounted and the coated paste material is heated and hardened so that a mounting operation can be executed. CONSTITUTION:A hardened Ag paste layer 4 is formed at a cavity part for pellet mounting use of a ceramic substrate 1. For this hardened Ag paste layer 4, an Ag paste is coated in advance on an inner bottom face of a cavity part before a semiconductor element pellet 2 is mounted; the paste is heat-treated and hardened. During this process, a heating operation must be executed slowly. An Ag paste 3 is coated on the hardened Ag paste layer 4 by using a dispensing system; the semiconductor element pellet is placed on this Ag paste. After that, this assembly is placed in a hightemperature furnace; the newly coated Ag paste is hardened; a mounting operation is completed. |
