Air-cooled hybrid electronic package.

摘要

Metallized ceramic (MC) modules (25), which are mounted on printed circuit cards (24), and multi-layer ceramic (MLC) modules (17), which are mounted on a printed circuit planar board (11), are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the MLC modules (17) after which it is directed to flow serially across the MC modules (25).