发明名称 PATTERN FORMATION
摘要 PURPOSE:To obtain a fine pattern through a process consisting of forming a desired pattern by making a desired pattern exposure to light of a desired pattern by a resist film obtained through the heat treatment of a coat made of a class-3 butyl methacrylate polymer, developing the exposure using a developer containing a keton series material and so forth and rinsing thus-obtained work using a cell-solve series organic solvent. CONSTITUTION:A class-3 butyl methacrylate polymer or copolymer of radioactiveray sensing positive type resist materials and a methyl methacrylate copolymer are mixed at a molar ratio of 3:7. Next, thus-obtained work is applied to an Si wafer and prebacked at about 250 deg.C for 1hr to form a resist film. Thereafter, electronic ray exposure is made using an electronic-ray drawing system, development using a developer containing a solvent selected out of keton, amide, cell-solve and ester series materials, and rinsing using a rinsing liquid containing a cell-solve series organic solvent. Thus, a high-sensitivity positive type resist is obrained for forming a fine pattern.
申请公布号 JPS5671939(A) 申请公布日期 1981.06.15
申请号 JP19790149167 申请日期 1979.11.16
申请人 CHO LSI GIJUTSU KENKYU KUMIAI 发明人 SAEKI HIDEO;KOUDA MASANOBU
分类号 H01L21/30;G03F7/039;G03F7/32;H01L21/027;(IPC1-7):01L21/30 主分类号 H01L21/30
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