PROCESS FOR THE ENCAPSULATION OF ELECTRONIC COMPONENTS WITH THE AID OF A MOULDABLE MATERIAL BASED ON A THERMOSETTING PREPOLYMER, AND ARTICLES OBTAINED BY THIS PROCESS

摘要

An active or passive electronic component is encapsulated within a bis-imido polymer molding composition, said polymer comprising (i) the thermosetting prepolymeric reaction product between a bis-imide having the structural formula: (I) in which D represents a divalent organic radical containing an olefinic carbon-carbon double bond and A is a divalent organic radical containing from 2 to 30 carbon atoms, and a polyamine having the structural formula: R(NH2)x (II) in which x is an integer equal to at least 2 and R represents an organic radical of valency x, the amount of bis-imide being 0.55 and 25 mols per mol of NH2 groups provided by the polyamine; and said molding composition further comprising (ii) a free-radical polymerization initiator, and (iii) filler.