| 摘要 |
PURPOSE:To facilitate the selection of semiconductor elements replacing ink with a fluorescent paint. CONSTITUTION:After inspection of characteristics, a marking 4 employing a fluorescent paint is given to defective ones among numerous elements formed on a semiconductor wafer 1. The back of the wafer is bonded on an adhesive thin plate 5 and grooves are inscribed. A breaking is made with an aid of the grooves 6 and 7 and then the thin plate 5 is stretched to separate the elements 2. Then, ultraviolet rays 8 irradiate the elements in the darkness and then, received with a sensor 9, which controls 10 a bar 11 and an attracting device 12 to remove the defective element 2a. This can eliminate the fatigue of operators' eye and the problem due to difference in personal abilities. |
