| 摘要 |
PURPOSE:To reduce deformation in the frame by a method wherein a cut-in groove is provided on a connecting piece constituting a lead frame in order to facilitate cutting after resin-sealing of a semiconductor element, but at this time, the groove is provided on the side opposite the side where the tub is pressed down. CONSTITUTION:Many lead pieces 15 are projected from a pair of frame members 11 and 12, parallel in the longitudinal direction, constituting a lead frame. A set of connecting pieces 13 are formed in the center of the lead group. Tub 14 is provided in this center part for fixing the semiconductor element. Next, the element is fixed on tub 14. The electrodes provided on the element are bonded to the respective lead pieces 15 by using wire. However, at this time, to prevent the wire from slackening, tub 14 is pushed down. In this structure, cut-in groove 16 to be provided on connecting piece 13 which supports this downward pressing force is formed on the lower side of connecting piece 13, so that the stress due to the downward pressing force is produced as a compression stress and thereby scattering in the tub lowering dimensions is minimized. |
