| 摘要 |
PURPOSE:To reduce the parts number and the process by a method wherein the frame coupling and the mold material are sealed while at the same time the crystal vibrator and the capacity are decided to be positioned, thus, being made to operate as a vibration buffer crystal supporting seat. CONSTITUTION:The circuit pattern 2 is formed on the circuit substrate 1, and the coupling area 2a and the solder bumper electrode 3 of the IC chip 3 are coupled. Thereafter, the thermoplastic bonding material sheet 10 of the specified shape is mounted on the specified position and it is heated to melt under the appropriate condition and then, the chip 3 is sealed. At the same time, the crystal oscillator 7 and the capacity 8, etc. are bound at the specified position and then, they are cooled and fixed. Thereafter, the circuit connection is performed. In this structure, the process is simplified, therefore, the process number is reduced and the yield is improved. Furthermore, the number of parts such as the mold frame and the stopper of crystal, etc. is reduced and the structure is permitted to be made small and thin. |
