| 发明名称 |
HALBLEITERVORRICHTUNG |
| 摘要 |
The present invention relates to a semiconductor device having a semiconductor element which is sealed by a ceramic package, wherein a shielding member is provided near it from upper surface of the semiconductor element to shield the alpha-particles radiated from the package. |
| 申请公布号 |
DE2951762(A1) |
申请公布日期 |
1980.07.10 |
| 申请号 |
DE19792951762 |
申请日期 |
1979.12.21 |
| 申请人 |
HITACHI,LTD. |
发明人 |
OTSUKA,KANJI;MITSUSADA,KAZUMICHI;SEKIBATA,MASAO;OHNISHI,SHINJI |
| 分类号 |
H01L23/02;H01L21/26;H01L21/314;H01L23/057;H01L23/24;H01L23/556;H01L27/10 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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