| 摘要 |
The specification describes a process for depositing a film of controlled composition on a substrate by using a metallo-organic photoresist in which the organic portion is combusted by heating in a reactive atmosphere to leave a residual deposit of a desired substance on the substrate. The film may be formed as a patterned or unpatterned layer. In addition, the residual deposit may be subsequently subjected to a chemical reaction to alter its composition. |
