发明名称 RESIN MOLDING METHOD
摘要 PURPOSE:To prevent from forming resin flash by applying an external force to an object which has s surface contacting to a set of molding dies before molding takes place. When the die set is pressed, the object is brought into tight contact with surfaces of the dies by a reaction force. CONSTITUTION:A header 15 of a reed frame 14 is held between an upper die 13 and a lower die 12 the both of which form a space 19. Header holding surfaces 22 and 23 of the dies 13 and 12 are tilt by an angle of theta, thus bending one end of the header upward. At the same time, the other end of the header locating directly above a space 20 in the molding set, is pressed down by the upper die and is brought into tight contact with the upper die surface. Consequently, flash is not formed because the resin does not penetrate into the contacting area even after the resin is supplied with high pressure, thus eliminating a resin flash chanfering operation.
申请公布号 JPS554913(A) 申请公布日期 1980.01.14
申请号 JP19780076468 申请日期 1978.06.26
申请人 HITACHI LTD 发明人 NAKAGAWA TAKASHI
分类号 H01L21/56;B29C43/00;B29C45/00;B29C45/02;B29C45/14;B29C45/26 主分类号 H01L21/56
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